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The StarTech thermal transfer compound improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. This ensures that the heatsink and fan can work at their full capacity to remove the harmful heat away from the CPU, and prevent burnout or heat damage.

Universal Copper Chipset Heatsink help to ensure the best possible heat dissipation for your VGA chipset, RAM chipset or motherboard chipset.

Active 2U Heat Sink Intel Xeon

4U ACTIVE HEATSINK LGA771-XEON 5000 SERIES 2800RPM

MODEL SNK-P0009 VENDOR- SUPERMICRO FEATURES Heatsink for 1U Chassis CEK www.supermicro.com support@supermicro.com

Intel LGA 771 1U Passive Cooler

All copper heatsink with larger area for improving heat dissipation Powerful and silent reversed fan which reduces the noise from air-rebounding Tool-free metal clip making installation easy

Pure copper heatsink with component layout optimized for maximum cooling efficiency Innovative, patented, and curved heatpipe design for a heat transfer capacity of up to six heatpipes with the use of just three Ultra slim fins (0.2mm) for minimized weight and reduced airflow resistanc

The perfect way to ensure you are getting the most from your AMD dual core (Socket AM2) or other K8 family processors, FANK8AM2 uses a 92mm ever-lubricate ball bearing fan to provide optimal cooling for hard working 64 bit CPUs. Featuring an aluminum heatsink to help dissipate and remove

AXXUPHS Passive Heatsink having features like it has been mechanically validated for use with the S3000PT board with direct chassis attach implementations. However, each customer will have a unique chassis implementation and it will be up to each customer to test and validate their system at th